Antenna module

ABSTRACT

An antenna module includes a first connection member including at least one first wiring layer and at least one first insulating layer; an antenna package disposed on a first surface of the first connection member, and including a plurality of antenna members and a plurality of feed vias; an integrated circuit (IC) disposed on a second surface of the first connection member and electrically connected to the corresponding wire of at least one first wiring layer; and a second connection member including at least one second wiring layer electrically connected to the IC and at least one second insulating layer, and disposed between the first connection member and the IC, wherein the second connection member has a third surface facing the first connection member and having an area smaller than that of the second surface, and a fourth surface facing the IC.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/112,432, filed Aug. 24, 2018, which claims the benefit of priority toKorean Patent Application No. 10-2018-0028802 filed on Mar. 12, 2018, inthe Korean Intellectual Property Office, the disclosures of which areincorporated herein by reference in their entireties.

TECHNICAL FIELD

The present disclosure relates to an antenna module.

BACKGROUND

Mobile communications data traffic is rapidly increasing every year.Technological developments are being actively conducted to support suchrapidly increasing data in real time in a wireless network. For example,applications such as contents of IoT (Internet of Thing) based data,augmented reality (AR), virtual reality (VR), live VR/AR combined withSNS, autonomous drive, sync view (a real time image of a user point ofview is transmitted using a ultra small camera), and the like needcommunications (e.g., 5G communications, mmWave communications, etc.)for supporting a transmission and a reception of a large amount of data.

Therefore, recently, millimeter wave (mmWave) communications including5th (5G) communications have been actively researched, and research intocommercialization/standardization of an antenna module smoothlyimplementing millimeter band wave communications are also activelyperformed.

Since radio frequency (RF) signals of high frequency bands (e.g., 24GHz, 28 GHz, 36 GHz, 39 GHz, 60 GHz, and the like) are easily absorbedin a transmission process and lead to loss, quality of communicationsmay be sharply deteriorated. Therefore, an antenna for communications ofthe high frequency bands requires a technical approach different from aconventional antenna technology, and may require special technologydevelopments such as a separate power amplifier for securing an antennagain, integrating an antenna and RFIC, securing effective isotropicradiated power (EIRP), and the like.

Conventionally, the antenna module providing a millimeter wavecommunications environment uses a structure in which an integratedcircuit (IC) and an antenna are disposed on a board and are connected toeach other by a coaxial cable in order to satisfy a high level ofantennal performance (e.g., a transmission and reception rate, a gain,directivity, and the like) according to a high frequency. However, sucha structure may cause a shortage of an antenna layout space, arestriction of the degree of freedom of an antenna shape, an increase ininterference between the antenna and the IC, sand an increase in thesize/cost of the antenna module.

SUMMARY

An aspect of the present disclosure may provide an antenna modulecapable of being miniaturized while securing a high level of antennaperformance by having a structure in which an antenna, an integratedcircuit (IC), and a second connection member are efficiently integratedwith one another.

According to an aspect of the present disclosure, an antenna module mayinclude a first connection member including at least one first wiringlayer and at least one first insulating layer; an antenna packagedisposed on a first surface of the first connection member, andincluding a plurality of antenna members configured to transmit and/orreceive a radio frequency (RF) signal and a plurality of feed vias inwhich one end of each thereof is electrically connected to each of theplurality of antenna members and the other end of each thereof iselectrically connected to a corresponding wire of at least one firstwiring layer; an integrated circuit (IC) disposed on a second surface ofthe first connection member and electrically connected to thecorresponding wire of at least one first wiring layer; and a secondconnection member including at least one second wiring layerelectrically connected to the IC and at least one second insulatinglayer, and disposed between the first connection member and the IC,wherein the second connection member has a third surface facing thefirst connection member end having an area smaller than that of thesecond surface, and a fourth surface facing the IC.

According to another aspect of the present disclosure, an antenna modulemay include a first connection member including at least one firstwiring layer and at least one first insulating layer; an antenna packagedisposed on a first surface of the first connection member, andincluding a plurality of antenna members configured to transmit and/orreceive a radio frequency (RF) signal and a plurality of feed vias inwhich one end of each thereof is electrically connected to each of theplurality of antenna members and the other end of each thereof iselectrically connected to a corresponding wire of at least one firstwiring layer; a support member disposed on a second surface of the firstconnection member and electrically connected to the corresponding wireof at least one first wiring layer so that an intermediate frequency(IF) signal or a base band signal passes therethrough; an integratedcircuit (IC) disposed on the second surface of the first connectionmember and electrically connected to the corresponding wire of at leastone first wiring layer to transmit the IF signal or the base band signalby receiving the RF signal or to transmit the RF signal by receiving theIF signal or the base band signal; and a second connection memberincluding at least one second wiring layer electrically connected to theIC and at least one second insulating layer, disposed between the firstconnection member and the IC, and surrounded by the support member.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a view illustrating an antenna module according to anexemplary embodiment in the present disclosure;

FIG. 2 is a view illustrating an antenna module according to anexemplary embodiment in the present disclosure in more detail;

FIG. 3 is a view illustrating a third connection member of the antennamodule according to an exemplary embodiment in the present disclosure;

FIG. 4 is a view illustrating a core via and an encapsulant of theantenna module according to an exemplary embodiment in the presentdisclosure;

FIG. 5 is a view illustrating a second support member of the antennamodule according to an exemplary embodiment in the present disclosure;

FIG. 6 is a view illustrating a layout of an integrated circuit (IC)cell in the antenna module according to an exemplary embodiment in thepresent disclosure;

FIG. 7 is a view illustrating a structure in which an IC cell of a firststructure is disposed in the antenna module according to an exemplaryembodiment in the present disclosure;

FIG. 8 is a view illustrating a structure in which an IC cell of asecond structure is disposed in the antenna module according to anexemplary embodiment in the present disclosure;

FIG. 9 is a view illustrating a cell shielding member in the antennamodule according to an exemplary embodiment in the present disclosure;

FIGS. 10A and 10B are views illustrating a process of manufacturing acell of an antenna module according to an exemplary embodiment in thepresent disclosure;

FIG. 11 is a view illustrating a process of manufacturing an antennamodule according to an exemplary embodiment in the present disclosure;

FIG. 12 is a view illustrating an upper surface of the antenna moduleaccording to an exemplary embodiment in the present disclosure;

FIGS. 13A through 13C are perspective views each illustrating an exampleof a cavity of an antenna package of the antenna module according to anexemplary embodiment in the present disclosure;

FIG. 14 is a perspective view illustrating an example of an antennapackage of the antenna module according to an exemplary embodiment inthe present disclosure;

FIG. 15 is a schematic block diagram illustrating an example of anelectronic device system;

FIG. 16 is a schematic perspective view illustrating an example of anelectronic device;

FIGS. 17A and I7B are a schematic cross-sectional view illustratingstates of a fan-in semiconductor package before and after beingpackaged;

FIG. 18 is schematic cross-sectional views illustrating a packagingprocess of a fan-in semiconductor package;

FIG. 19 is a schematic cross-sectional view illustrating a case in whicha fan-in semiconductor package is mounted on an interposer substrate andis finally mounted on a mother board of an electronic device;

FIG. 20 is a schematic cross-sectional view illustrating a case in whicha fan-in semiconductor package is embedded in an interposer substrateand is finally mounted on a mother board of an electronic device;

FIG. 21 is a schematic cross-sectional view illustrating a fan-outsemiconductor package; and

FIG. 22 is a schematic cross-sectional view illustrating a case in whicha fan-out semiconductor package is mounted on a mother board of anelectronic device.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will now bedescribed in detail with reference to the accompanying drawings. In theaccompanying drawings, shapes, sizes, and the like, of components may beexaggerated or stylized for clarity.

The present disclosure may, however, be exemplified in many differentforms and should not be construed as being limited to the specificembodiments set forth herein. Rather these embodiments are provided sothat this disclosure will be thorough and complete, and will fullyconvey the scope of the disclosure to those skilled in the art.

The term “an exemplary embodiment” used herein does not refer to thesame exemplary embodiment, and is provided to emphasize a particularfeature or characteristic different from that of another exemplaryembodiment. However, exemplary embodiments provided herein areconsidered to be able to be implemented by being combined in whole or inpart one with another. For example, one element described in aparticular exemplary embodiment, even if it is not described in anotherexemplary embodiment, may be understood as a description related toanother exemplary embodiment, unless an opposite or contradictorydescription is provided therein.

The meaning or a “connection” of a component to another component in thedescription includes an indirect connection through a third component aswell as a direct connection between two components. In addition,“electrically connected” means the concept including a physicalconnection and a physical disconnection. It can be understood that whenan element is referred to with “first” and “second”, the element is notlimited thereby. They may be used only for a purpose of distinguishingthe element from the other elements, and may not limit the sequence orimportance of the elements. In some cases, a first element may bereferred to as a second element without departing from the scope of theclaims set forth herein. Similarly, a second element may also bereferred to as a first element.

Herein, an upper portion, a lower portion, an upper side, a lower side,an upper surface, a lower surface, and the like, are decided in theaccompanying drawings. For example, a first connection member isdisposed on a level above a redistribution layer. However, the claimsare not limited thereto. In addition, a vertical direction refers to theabovementioned upward and downward directions, and a horizontaldirection refers to a direction perpendicular to the abovementionedupward and downward directions. In this case, a vertical cross sectionrefers to a case taken along a plane in the vertical direction, and anexample thereof may be a cross-sectional view illustrated in thedrawings. In addition, a horizontal cross section refers to a case takenalong a plane in the horizontal direction, and an example thereof may bea plan view illustrated in the drawings.

Terms used herein are used only in order to describe an exemplaryembodiment rather than limiting the present disclosure. In this case,singular forms include plural forms unless interpreted otherwise incontext.

FIG. 1 is a view illustrating an antenna module according to anexemplary embodiment in the present disclosure.

Referring to FIG. 1 , an antenna module according to an exemplaryembodiment in the present disclosure may have a structure in which anantenna 10 a, an integrated circuit (IC) 20 a, and a second connectionmember 30 a are integrated with one another, and may include the antenna10 a, a second directional antenna 15 a, a chip antenna 16 a, the IC 20a, a passive component 40 a, a substrate 50 a, and a sub-substrate 60 a.

The substrate 50 a may include at least one wiring layer 51 a and atleast one insulating layer 52 a and may include at least one viapenetrating through the insulating layer to electrically connect aplurality of wiring layers to each other. For example, the substrate 50a may be implemented as a printed circuit board and may have a structurein which an antenna package of an upper end and a connection member of alower end are coupled to each other. For example, the antenna packagemay be designed in view of transmission and reception efficiency of aradio frequency (RF) signal, and the connection member may be designedin view of wiring efficiency.

The antenna 10 a may receive or transmit the RF signal, and may transmitthe received RF signal to the IC 20 a or receive an RF signal fortransmission from the IC 20 a. The antenna 10 a may include a pluralityof antenna members, thereby further improving antenna performance.

The antenna 10 a may be disposed on an upper end of the substrate 50 totransmit and receive the RF signal, and may be implemented by theplurality of antenna members. For example, the antenna 10 a may have astructure of a patch antenna and may be disposed to be adjacent to anupper surface of the substrate 50 a.

The second directional antenna 15 a may be disposed to be adjacent to aside surface of the substrate 50 a to transmit and receive the RF signalin a side surface direction. For example, the second directional antenna15 a may have a structure of a dipole antenna or a microstrip antenna.

The chip antenna 16 a may have a three-dimensional structure including adielectric having a high dielectric constant and a plurality ofelectrodes disposed on opposite surfaces of the dielectric, and may bedisposed to be adjacent to the upper surface and the side surface of thesubstrate 50 a to transmit and receive the RF signal in a side surfacedirection and/or an upper surface direction.

The antenna module according to an exemplary embodiment in the presentdisclosure may include at least two of the antenna 10 a, the seconddirectional antenna 15 a, and the chip antenna 16 a, therebyomni-directionally forming a radiation pattern.

The IC 20 a may convert the received RF signal into an intermediatefrequency (IF) signal or a base band signal, and may transmit theconverted IF signal or based band signal to an IF IC, a base band IC, ora communication modem disposed outside or the antenna module. Inaddition, the IC 20 a may convert the IF signal or the base band signalreceived from the IF IC, the base band IC, or the communication modemdisposed outside of the antenna module into an RF signal, and transmitthe converted RF signal to the antenna 10 a. Here, frequencies (e.g., 24GHz, 28 GHz, 36 GHz, 39 GHz, and 60 GHz) of the RF signal may be greaterthan those (e.g., 2 GHz, 5 GHz, 10 GHz, and the like) of the IF signal.Meanwhile, the IC 20 a may perform at least some of a frequencyconversion, amplification, filtering, a phase control, and a powergeneration to generate a converted signal.

The IC 20 a and the passive component 40 a may be disposed to beadjacent to a lower surface of the substrate 50 a. The passive component40 a may include a capacitor (e.g., a multilayer ceramic capacitor(MLCC)), an inductor, or a chip resistor to provide required impedanceto the IC 20 a.

The sub-substrate 60 a may be disposed on the lower surface of thesubstrate 50 a, and may provide a path of the IF signal or the base bandsignal. The sub-substrate 60 a may be implemented as a support memberseated on an outer surface of the antenna module to support the antennamodule.

The IC 20 a may require a plurality of ground patterns to improveperformance in the process of generating the converted signal, and mayrequire additional electrical paths between the respective componentswithin the IC 20 a.

Although the substrate 50 a may provide the plurality of ground patternsand the additional electrical paths, it may cause an increase of a size(e.g., an area and a height of a layer) due to securing of a spacecorresponding to the plurality of ground patterns and the additionalelectrical paths. In addition, the substrate 50 a may not have more thana predetermined number of layers depending on structural characteristicsthereof. Furthermore, the substrate 50 a may require an additional spacefor antenna performance or wiring efficiency.

Therefore, the antenna module according to an exemplary embodiment inthe present disclosure may include a second connection member 30 adisposed between the substrate 50 a and the IC 20 a. For example, thesecond connection member 30 a may provide the ground pattern and theadditional electrical paths required by the IC 20 a. Accordingly, thesubstrate 50 a may be miniaturized without separately sacrificingantenna performance or wiring efficiency.

In addition, an area of an upper surface of the second connection member30 a may be smaller than that of the lower surface of the substrate 50a. Accordingly, the second connection member 30 a may be more easilycoupled to the substrate 50 a. For example, the second connection member30 a may be formed sequentially from the upper surface of the IC 20 a inunits of layers and may be then bonded to the substrate 50 a.

FIG. 2 is a view illustrating an antenna module according to anexemplary embodiment in the present disclosure in more detail.

Referring to FIG. 2 , the antenna module according to an exemplaryembodiment in the present disclosure may include a substrate having astructure in which an antenna package 100 a and a connection member 200a are coupled to each other.

The antenna package 100 a may include a plurality of antenna members 115a configured to transmit or receive an RF signal, and a plurality offeed vias 120 a. One end of each of the feed vias 120 a is electricallyconnected to one of the plurality of antenna members 115 a and the otherend of each of the feed vias 120 a is electrically connected to acorresponding wire of at least one wiring layer 210 a of the connectionmember 200a. The antenna package 100a may further include a dielectriclayer 140 a having a thickness greater than that of at least oneinsulating layer 220 a o. the connection layer 200 a, and may bedisposed on an upper end of the connection member 200 a. Accordingly,the antenna module according to an exemplary embodiment in the presentdisclosure may form a radiation pattern in an upper surface direction totransmit and receive the RF signal.

Due to a length of the feed via 120 a and the thickness of thedielectric layer 140 a, a boundary condition for transmission andreception operation of the RF signal of the plurality or antenna members115 a may be freely designed, and an unnecessary boundary condition(e.g., an interlayer interval, an interlayer implant, or the like) maybe removed. Accordingly, since the feed vias 120 a and the dielectriclayer 140 a may provide the boundary conditions (e.g., a smallmanufacturing tolerance, a short electrical length, a smooth surface, alarge margin space, a dielectric constant adjustment, and the like)advantageous in the transmission and reception operation of the RFsignal of the plurality of antenna members 115 a, antenna performance ofthe plurality of antenna members 115 a may be improved.

The dielectric layer 140 a may be formed of a thermosetting resin suchas an epoxy resin, a thermoplastic resin such as a pdlyimide resin, aresin in which the thermosetting resin or the thermoplastic resin isimpregnated together with an inorganic filler in a core material such asa glass fiber (or a glass cloth or a glass fabric), for example,prepreg, Ajinomoto Build up Film (ABF), FR-4, Bismaleimide Triazine(BT), or the like, and may be formed of a photo imagable dielectric(PID) resin depending on a design. For example, the dielectric layer 140a may be formed of a generic copper clad laminate (CCL) or a glass orceramic based insulating material depending on required materialcharacteristics. Depending on a design, the dielectric layer 140 a maybe formed of a materiel having a dielectric constant Dk higher than thatof at least one insulating layer 220 a of the connection member 200 a.

Depending on a design, the antenna package 100 a may further include aplurality of director members 110 a disposed on the plurality of antennamembers 115 a and configured to transmit or receive a first RF signaltogether with the plurality of antenna members 115 a. The number oflayers on which the plurality of director members 110 a are formed maybe determined depending on design conditions of a gain and a height ofthe antenna module. Therefore, the number of layers is not limited toone.

Depending on a design, the antenna package 100 a may include a platingmember 160 a disposed to surround a side surface of each of the feedvias 120 a and forming a plurality of cavities. The plurality ofcavities may provide the boundary conditions (e.g., a smallmanufacturing tolerance, a short electrical length, a smooth surface, alarge margin space, a dielectric constant adjustment, and the like)advantageous in forming the radiation patterns of the plurality ofantenna members 115 a, and may improve isolation between the pluralityof antenna members 115 a.

Depending on a design, the antenna package 100 a may further include acavity ground layer 165 a disposed to be adjacent to the connectionmember 200 a. The cavity ground layer 165 a may improve isolationbetween the antenna package 100 a and the connection member 200 a.

Depending on a design, the antenna package 100 a may further include anencapsulation member 150 a disposed on the plurality of antenna members115 a. The encapsulation member 150 may be formed of a material thatchanges to a solid state after it partially permeates into the antennamember 115 a while in a liquid state. Accordingly, structural stabilityof the antenna package 100 a may be improved. In addition, the toencapsulation member 150 may be formed together with the plurality ofdirector members 110 a in a process of forming the encapsulation member150 a. The encapsulation member 150 a may be formed of a photo imageableencapsulant (PIE), Ajinomoto build-up film (ABF), epoxy molding compound(EMC), or the like, but is not limited thereto.

Meanwhile, the director members 110 a, the antenna members 115 a, thefeed vias 120 a, the plating member 160 a, and the cavity ground layer165 a may be formed or a conductive material such as copper (Cu),aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb),titanium (Ti), or an alloy thereof, and may be formed by a platingmethod such as chemical vapor deposition (CVD), physical vapordeposition (PVD), sputtering, subtractive, additive, semi-additiveprocess (SAP), modified semi-additive process (MSAP), or the like, butis not limited thereto.

Referring to FIG. 2 , the connection member 200 a may include at leastone wiring layer 210 a, at least one insulating layer 220 a, a wiringvia 230 a, a connection pad, a passivation layer, and an electricalconnection structure, and may have a structure similar to a copperredistribution layer (RDL).

For example, a portion and the remainder of each of at least one wiringlayer 210 a, at least one insulating layer 220 a, and the wiring via 230a included in the connection member 200 may be manufacturedindependently from each other and may be then connected to each otherthrough the connection pad, the passivation layer, and the electricalconnection structure. Depending on a design, since at least one wiringlayer 210 a, at least one insulating layer 220, and wiring via 230 a maybe integrally manufactured, the connection pad, the passivation layer,and the electrical connection structure may be omitted.

Referring to FIG. 2 , an antenna module according to an exemplaryembodiment in the present disclosure may include an IC 300 a and asecond connection member 390 a.

The IC 300 a may have an active surface (e.g., an upper surface)electrically connected to at least one wiring layer 210 a and aninactive surface (e.g., a lower surface) opposite the active surface,and may transmit the RF signal to the antenna package 100 a and receivethe RF signal from the antenna package 100 a.

The second connection member 390 a may include at least one secondwiring layer 391 a electrically connected to the IC 300 a, at least onesecond insulating layer 392 a, and an IC pad 393 a directly connected tothe IC 300 a.

An area of an upper surface of the second connection member 390 a may besmaller than that of the lower surface of the connection member 200 a.Accordingly, the second connection member 390 a may be more easilycoupled to the connection member 200 a. For example, an antenna modulein which at least one wiring layer 210 a of the connection member 300 aincludes a total of three layers and at least one second wiring layer391 a of the second connection member 390 a includes a total of threelayers may be more stable and have a lower process error rate ascompared to a case in which at least one wiring layer 210 a of theconnection member 200 a includes a total of five layers and the secondconnection member 390 a is not disposed.

Therefore, the antenna module according to an exemplary embodiment inthe present disclosure may have a stable structure while improving ICperformance, antenna performance, and wiring efficiency by securing morewiring layers.

In addition, the second connection member 390 a and the connectionmember 200 a may be bonded to each other without using a separateelectrical connection structure such as a solder ball. Accordingly, theantenna module according to an exemplary embodiment in the presentdisclosure may be miniaturized.

FIG. 3 is a view illustrating a third connection member of the antennamodule according to an exemplary embodiment in the present disclosure.

Referring to FIG. 3 , the antenna module according to an exemplaryembodiment in the present disclosure may include a third connectionmember 400 a disposed on the lower surface of the connection member 200a. Since the third connection member 400 a is disposed adjacent to thesecond connection member 390 a, the antenna module according to anexemplary embodiment in the present disclosure may include the thirdconnection member 400 a without separately sacrificing a size thereof.

For example, a second IC (not shown) may be disposed on a lower surfaceof the third connection member 400 a and may be electrically connectedto a third wiring layer of the third connection member 400 a.Accordingly, the second connection member 390 a may be optimized for theIC 300 a and the third connection member 400 a may be optimized for thesecond IC (not shown).

FIG. 4 is a view illustrating a core via and an encapsulant of theantenna module according to an exemplary embodiment in the presentdisclosure.

Referring to FIG. 4 , the antenna module according to an exemplaryembodiment in the present disclosure may include an encapsulant 305 b,an electrical connection structure 340 b, a passive component 350 b, anda core via 360 b.

The encapsulant 305 b may encapsulate at least a portion of the IC 300a. The encapsulant 305 b may protect the IC 301 b from externalelectrical/physical/chemical impact, and may be formed of a photoimageable encapsulant (PIE), Ajinomoto build-up film (ABF), epoxymolding compound (EMC), or the like, but is not limited thereto.

The electrical connection structure 340 b may electrically connect thecore via 360 b and the outside of the antenna module to each other. Forexample, the electrical connection structure 340 b may have a structuresuch as a solder bail, a pin, and a land.

Since the core via 360 b may electrically connect the electricalconnection structure 340 b and at least one wiring layer 210 a of theconnection member 200 a to each other, the core via 360 b may be used asa pass path of the IF signal or the base band signal.

FIG. 5 is a view illustrating a second support member of the antennamodule according to an exemplary embodiment in the present disclosure.

Referring to FIG. 5 , the antenna module according to an exemplaryembodiment, in the present disclosure may include a second supportmember 385 b disposed on the side surface of the IC 300 a and on thelower surface of the second connection member 390 a, a second coreinsulating layer 386 b, and a second core plating member 387 b disposedon a side surface on the second support member 385 b.

Accordingly, the second connection member 390 a may be more easilyformed from the upper surface of the IC 300 a and may be bonded to theconnection member in a more balancing way. In addition, isolationbetween the IC 300 a and the core via 360 b may be further improved.

FIG. 6 is a view illustrating a layout of an integrated circuit (IC)cell in the antenna module according to an exemplary embodiment in thepresent disclosure.

FIG. 7 is a view illustrating a structure in which an IC cell of a firststructure is disposed in the antenna module according to an exemplaryembodiment in the present disclosure.

Referring to FIG. 6 , the antenna module according to an exemplaryembodiment in the present disclosure may include an upper end wiringlayer 310 c, a lower end wiring layer 320 c, an electrical connectionstructure 340 c, a passive component 350 c, a support member 355 c, acore via 360 c, and a core plating member 365 c.

The upper end wiring layer 310 c may be disposed on an upper end of thesupport member 355 c or may be disposed to be adjacent to the connectionmember 200 a, and may electrically connect between the active surface ofthe IC 300 a and the core via 360 c. Accordingly, the IC 300 a maysecure a transfer path of the IF signal or the base band signal.

The lower end wiring layer 320 c may be disposed on a lower end of thesupport member 355 c and may be electrically connected to the core via360 c.

The passive component 360 c may be disposed on the lower surface of theconnection member 200 a and may be disposed in an accommodating space307 c of the support member 355 c. The accommodating space 307 c may befilled with the same material as that of the encapsulant 305 b.

The support member 355 c may include at least one core wiring layer, atleast one core insulating layer 356 c, and a core via 360 c. The corevia 360 c may be a pass path of the IF signal or the base band signal.

That is, the IF signal or the base band signal may pass through theelectrical connection structure 340 c, the core via 360 c, the upper endwiring layer 310 c, and the IC 300 a in this order.

The core plating member 365 c may be disposed on a side surface of thesupport member 355 c in a direction from the support member 355 c to theIC 300 a. Since the core plating member 365 c may improve isolationbetween the IC 300 a and the support member 355 c, noise of the IFsignal or the base band signal may be reduced. In addition, the coreplating member 365 c may efficiently radiate heat generated from the IC300 a to the outside of the antenna module.

Referring to FIGS. 6 and 7 , the antenna module according to anexemplary embodiment in the present disclosure may be implemented byinserting a cell formed by the second connection member 390 a, the IC300 a, the second support member 385 b, the second core insulating layer386 b, the second core plating member 387 b, and the encapsulantthereinto. Accordingly, the second connection member 390 a may be moreeasily coupled to the connection member 200 a.

In addition, since the second connection member 390 a is disposed on theside surface of the support member 355 c, the antenna module accordingto an exemplary embodiment in the present disclosure may increase thenumber of wiring layers without separately increasing a size thereof dueto an addition of the second connection member 390 a, and may thus havea high level of antenna performance and have a structure that is easy tominiaturize.

Meanwhile, depending on a design, the antenna module according to anexemplary embodiment in the present disclosure may include a dummymember (not shown) disposed between the support member 355 c and thesecond connection member 390 a and disposed on the lower surface of theconnection member 200 a. Accordingly, since the lower surface of theconnection member 200 a may be more structurally stabilized, durabilityof the antenna module may be improved.

FIG. 8 is a view illustrating a structure in which an IC cell of asecond structure is disposed in the antenna module according to anexemplary embodiment in the present disclosure.

Referring to FIG. 8 , the second support member, the second coreinsulating layer, and the second core plating member may be omitted.

FIG. 9 is a view illustrating a cell shielding member in the antennamodule according to an exemplary embodiment in the present disclosure.

Referring to FIG. 9 , the antenna module according to an exemplaryembodiment in the present disclosure may include a cell shielding member395 c covering side surfaces and a lower surface of a cell formed by thesecond connection member 390 a, the IC 300 a, the second support member385 b, the second core insulating layer 386 b, the second core platingmember 387 b, and the encapsulant.

Accordingly, isolation between the IC 300 a and the core via 360 c maybe further improved and structural stability in a process of bonding thecell may also be improved.

FIGS. 10A and 10B are views illustrating a process of manufacturing acell of an antenna module according to an exemplary embodiment in thepresent disclosure.

Referring to FIG. 10A, a support member 355 e and a core insulatinglayer 356 e may be provided on a film 380 e with at least one ICaccommodating space. Next, a core plating member 365 e may be formed ona side surface of the region formed by the support member 355 e and thecore insulating layer 356 e. Next, an IC 300 e may be disposed in the ICaccommodating space such that the active surface of the IC 300 e facesthe film 380 e. An encapsulant 305 e may encapsulate at least a portionof the IC 300 e. Next, the antenna module may be flipped upside down.Next, the film 380 e may be removed and an IC pad 393 e and a secondinsulating layer 394 e may be disposed on an upper surface of the IC 300.

Referring to FIG. 10B, a second wiring layer 391 e and a secondinsulating layer 392 e may be disposed on upper surfaces of the IC pad393 e and the second insulating layer 394 e, respectively. Next, atleast a portion of each of the support member 355 e, the core insulatinglayer 356 e, and the second insulating layers 392 e and 394 e may beremoved. Accordingly, a cell of the antenna module may be completed.

Here, the support member 355 e of which the portion is removed, the coreinsulating layer 356 e of which the portion is removed, and the coreplating member 365 e may be configured as the second support member 385b, the second core insulating layer 386 b, and the second core platingmember 387 b, respectively, in the antenna module.

FIG. 11 is a view illustrating a process of manufacturing an antennamodule according to an exemplary embodiment in the present disclosure.

Referring to FIG. 11 , a support member 355 f may provide with at leastone hole and accommodating space, a core via 360 f may be formed in atleast one hole of the support member 335 f, and a passive component 350f may be disposed in the accommodating space.

A core insulating layer 356 f may be formed on an upper surface and alower surface of the support member 355 f.

A support member 355 f may be provided on a film 380 f. A region of thesupport member 355 f in which a cell is to be disposed may be removedand a core plating member 365 f may be formed on a side surface of theregion. The cell may be disposed on the region.

The cell may be encapsulated by an encapsulant 305 f. Next, the antennamodule may be rotated. Next, an antenna package and a connection membermay be disposed on an upper surface of the antenna module.

FIG. 12 is a view illustrating an upper surface of an antenna moduleaccording to an exemplary embodiment in the present disclosure.

Referring to FIG. 12 , each of a plurality of director members 110-1,110-2, 110-3, 110-4, 110-5, 110-6, 110-7, 110-8, and 110-9 may besurrounded by at least one of corresponding plating members 160-1,160-2, 160-3, 160-4, 160-6, 160-7, 160-8, and 160-9, and a plurality ofshielding vias 190-1, 190-2, 190-3, 190-4, 190-5, 190-6, 190-7, 190-8,and 190-9. If the antenna module does not include the plurality ofdirector members, the plurality of director members 110-1, 110-2, 110-3,110-4, 110-5, 110-6, 110-7, 110-8, and 110-9 may be replaced with aplurality of antenna members.

Meanwhile, the number, layout, and shape of the plurality of directormembers or the plurality of antenna members illustrated in FIG. 12 arenot particularly limited. For example, the number of the plurality ofantenna members illustrated in FIG. 12 may be four or sixteen.

Meanwhile, a plurality of shielding vias illustrated in FIG. 12 may bereplaced with plating members and the plating members illustrated inFIG. 12 may also be replaced with the plurality of shielding vias.

FIGS. 13A through 13C are perspective views each illustrating an exampleof a cavity of an antenna package according to an exemplary embodimentin the present disclosure.

Referring to FIG. 13A, a cavity may include at least portions of adirector member 110 e, an antenna member 115 e, a feed via, anelectrical connection structure, a dielectric layer 130 e, and a platingmember 160 e. Here, the plating member 160 e may be disposed to surroundside surfaces of the cavity. That is, a lower surface of the cavity maybe covered by a ground pattern disposed on an upper surface of theconnection member.

Referring to FIG. 13B, the cavity may include at least portions of adirector member 110 f, an antenna member 115 f, a feed via 120 f, anelectrical connection structure 125 f, a dielectric layer 130 f, and aplating member 160 f. Here, the plating member 160 f may be disposed tocover a portion of the lower surface of the cavity. That is, the sidesurfaces of the cavity may be surrounded by the plating member disposedon side surfaces of an insulating member on the connection member.Accordingly, isolation between the connection member and the IC of theantenna package may be improved.

Referring to FIG. 13C, the cavity may include at least portions of anantenna member 110 g, a feed via 120 g, an electrical connectionstructure 125 g, and a dielectric layer 130 g. That is, the sidesurfaces of the cavity may be surrounded by the plating member disposedon the side surfaces of the insulating member on the connection member,and the lower surface of the cavity may be covered by the ground patterndisposed on the upper surface of the connection member.

Meanwhile, the electrical connection structures 125 f and 125 g may beconnected to a corresponding wire of at least one wiring layer of theconnection member when the antenna package and the connection member arecoupled to each other. For example, the electrical connection structures125 f and 125 g may be implemented in electrodes, pins, solder balls,lands, and the like.

FIG. 14 is a perspective view illustrating an example of an antennapackage according to an exemplary embodiment in the present disclosure.

Referring to FIG. 14 , since an antenna package may include a pluralityof director members 110 d, a cavity 130 d, a dielectric layer 140 d, aplating member 160 d, a plurality of second directional antennal member170 c and 170 d, and a plurality of dipole antennas 175 c and 175 d, theantenna module according to an exemplary embodiment in the presentdisclosure may omni-directionally form a radiation pattern.

The plurality of director members 110 d may transmit and receive an RFsignal in a z axis direction together with corresponding antennamembers.

A plurality of second directional antenna members 170 c and 170 b may bedisposed to be adjacent to an edge of the antenna package and to bestood up in the z axis direction, and one of the plurality ofdirectional antennas 170 c and 170 d may transmit and receive a secondRF signal in an x axis direction and the other thereof may transmit andreceive the second RF signal in a y axis direction.

A plurality of dipole antennas 175 c and 175 d may be disposed betweenthe dielectric layer 140 d and an encapsulation member to be adjacent tothe edge of the antenna package, and one of the plurality of dipoleantennas 175 c and 175 d may transmit and receive a third RF signal inthe x axis direction and the other thereof may transmit and receive thethird RF signal in the y axis direction. Depending on a design, at leasta portion of the plurality of dipole antennas 175 c and 175 d may bereplaced with a monopole antenna.

Meanwhile, the connection member, the support member, the core via, theIC, and the absorption member may be implemented according to a fan-outsemiconductor package to be described below. To facilitate understandingof the fan-out semiconductor package, a description will be made withreference to FIGS. 15 through 22 .

FIG. 15 is a block diagram schematically illustrating an example of anelectronic device system.

Referring to FIG. 15 , an electronic device 1000 accommodates a motherboard (or mother substrate) 1010. The mother board 1010 is physicallyand/or electrically connected to a chip-related component 1020, anetwork-related component 1030, and other component 1040. The componentsare also combined with any other electronic component (to be describedlater) to form various signal lines 1090.

The chip-related component 1020 includes a memory chip such as avolatile memory (e.g., a DRAM), a non-volatile memory (e.g., a ROM), aflash memory, and the like, an application processor chip such as acentral processor (e.g., a CPU), a graphics processor (e.g., GPU), adigital signal processor, a cryptographic processor, a microprocessor, amicro-controller, and the like, a logic chip such as ananalog-to-digital converter, an application-specific IC (ASIC), and thelike, but the chip-related component 1020 is not limited thereto and mayinclude any other types of chip-related electronic component. Also,these electronic components 1020 may be combined with each other.

The network-related component 1030 may include Wi-Fi (IEEE 802.11family, etc.), WiMAX (IEEE 802.16 family, etc.), IEEE 802.20, long termevolution (LTE), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS,CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and any other wireless andwired protocols designated thereafter. However, the network-relatedcomponent 1030 is not limited thereto and any other among a plurality ofwireless or wired standards or protocols. Also, the network-relatedcomponent 1030 may be combined with the chip-related electroniccomponent 1020.

The other component 1040 includes a high-frequency inductor, a ferriteinductor, a power inductor, a ferrite bead, a Low Temperature Co-FiredCeramic (LTCC), an Electro Magnetic Interference (EMI) filter, aMultilayer Ceramic Condenser (MLCC), and the like, but is not limitedthereto and may include passive components used for various otherpurposes. It is also to be understood that other components 1040 may becombined with each other in conjunction with the chip-related electroniccomponent 1020 and/or the network-related electronic component 1030.

According to types of electronic device 1000, the electronic device 1000may include other electronic components that may or may not bephysically and/or electrically connected to the mother board 1010. Theother electronic components include, for example, a camera 1050, anantenna 1060, a display 1070, a battery 1080, an audio codec (notshown), a video codec (not shown), a power amplifier (not shown), acompass (not shown), an accelerometer (not shown), a gyroscope (notshown), a speaker (not shown), a mass storage device (e.g., a hard diskdrive) (not shown), a compact disk (CD) (not shown), a digital versatiledisk (DVD) (not shown), and the like. However, the other electroniccomponents are not limited thereto and may include other electroniccomponents used for various purposes according to types of theelectronic device 1000.

The electronic device 1000 may be a smart phone, a personal digitalassistant (PDA), a digital video camera, a digital still camera, anetwork system, a computer, a monitor, a tablet, a laptop, a netbook, atelevision, a video game, a smart watch, an automotive, and the like.However, the electronic device 1000 is not limited thereto and may beany other electronic device that processes data.

FIG. 16 is a perspective view schematically illustrating an example ofan electronic device.

Referring to FIG. 16 , the electronic device may be, for example, asmartphone 1100. A radio frequency integrated circuit (RF IC) may beapplied in the form of a semiconductor package to the smartphone 1100,and an antenna may be applied in the form of a substrate or a module. Asthe RF IC and an antenna are electrically connected in the smartphone1100, an antenna signal may be radiated (R) in various directions. Thesemiconductor package including the RF IC and the substrate or moduleincluding the antenna may be applied in various forms to an electronicdevice such as a smartphone, or the like.

Generally, a semiconductor chip has many microelectronic circuitsintegrated therein, but the semiconductor chip itself may not serve as afinished semiconductor product and has a possibility of being damaged byan external physical or chemical impact. Therefore, the semiconductorchip itself is not used as is but is packaged so that the semiconductorchip in a package state is used in an electronic device.

The reason that the semiconductor packaging is required, is becausethere is a difference in circuit width between the semiconductor chipand the mother board of the electronic device from the viewpoint ofelectrical connection. Specifically, in the case of the semiconductorchip, sizes of the connection pads and a spacing between the connectionpads are very small. Meanwhile, in the case of a mother board used in anelectronic device, a size of an electronic component mounting pad and aspacing between the electronic component mounting pads are much biggerthan a scale of the semiconductor chip. Therefore, it may be difficultto directly mount the semiconductor chip on such a mother board, and apackaging technique which may buffer the difference in circuit widththerebetween is required.

The semiconductor package manufactured by such a packaging technique maybe classified as a fan-in semiconductor package and a fan-outsemiconductor package according structures and purposes.

Hereinafter, the fan-in semiconductor package and the fan-outsemiconductor package will be described in detail with reference to theaccompanying drawings.

FIGS. 17A and 17B are a cross-sectional view schematically illustratingstates before and after packaging a fan-in semiconductor package.

FIG. 18 is a cross-sectional view schematically illustrating a packagingprocess of a fan-in semiconductor package.

Referring to FIGS. 17A, 17B and 18 , a semiconductor chip 2220 may be,for example, a bare integrated circuit (IC) including a body 2221including, silicon (Si), germanium (Ge), a gallium arsenide (GaAs), andthe like, a connection pad 2222 formed on one surface of the body 2221and including a conductive material such as aluminum (Al), or the like,and a passivation film 2223 such as an oxide film or a nitride filmformed on one surface of the body 2221 and covering at least a portionof the connection pads 2222. Here, since the connection pad 2222 is verysmall, it is difficult for the IC to be mounted even on a medium-levelPCB, let alone a mother board of an electronic device, and the like.

In order to rewire the connection pad 2222, a connection member 2240 isformed on the semiconductor chip 2220 according to a size of thesemiconductor chip 2220. The connection member 2240 may be formed byforming an insulating layer 2241 with an insulating material such as aphotosensitive insulating resin (FID) on the semiconductor chip 2220,forming a via hole 2243 h opening the connection pad 2222, andsubsequently forming a wiring pattern 2242 and a via 2243. Thereafter, apassivation layer 2250 for protecting the connection member 2240 isformed, an opening 2251 is formed, and an underbump metallization layer2260, or the like, is subsequently formed. That is, through a series ofprocesses, a fan-in semiconductor package 2200 including, for example,the semiconductor chip 2220, the connection member 2240, the passivationlayer 2250, and the underbump metallization layer 2260 is manufactured.

As described above, the fan-in semiconductor package may be in the formof a package in which the connection pads of the semiconductor chip, forexample, input/output (I/O) terminals are all disposed inside thedevice, may have good electrical properties, and may be produced at lowcost. Accordingly, many devices to be disposed in a smartphone aremanufactured in the form of the fan-in semiconductor package anddevelopment is being made toward realization of a small size and fastsignal transmission.

However, in the fan-in semiconductor package, all of the I/O terminalsmust be disposed inside the semiconductor chip, so that there are manyspace limitations. Therefore, such a structure is difficult to apply toa semiconductor chip having a large number of I/O terminals or asemiconductor chip having a small size. In addition, due to thevulnerability, the fan-in semiconductor package may not be directlymounted on a mother board of an electronic device. Although the size andspacing of the I/O terminals of the semiconductor chip are enlarged by arewiring process, the I/O terminals may not have a size and spacingenough to be directly mounted on the mother board of the electronicdevice.

FIG. 19 is a cross-sectional view schematically illustrating a casewhere a fan-in semiconductor package is mounted on an interposersubstrate and ultimately mounted on a mother board of an electronicdevice.

FIG. 20 is a cross-sectional view schematically illustrating a casewhere a fan-in semiconductor package is embedded in an interposersubstrate and ultimately mounted on a mother board of an electronicdevice.

Referring to FIGS. 19 and 20 , the connection pads 2222, that is, theI/O terminals, of the semiconductor chip 2220 of the fan-insemiconductor package 2200 are re-wired again through an interposersubstrate 2301 and the fan-in semiconductor package 2200 mounted on theinterposer substrate 2301 may ultimately be mounted on a mother board2500 of an electronic device. Here, the electrical connection structure2270, and the like, may be fixed by an underfill resin 2280, and thelike, and the outer side may be covered with a molding material 2290, orthe like. Alternatively, the fan-in semiconductor package 2200 may beembedded in a separate interposer substrate 2302, the connection pads2222, i.e., the I/O terminals, of the semiconductor chip 2220 may bere-wired again by the interposer substrate 2302 in the embedded state,and the fan-in semiconductor package 2200 may ultimately be mounted onthe mother board 2500 of the electronic device.

In this manner, since the fan-in semiconductor package is difficult tobe directly mounted on the mother board of the electronic device, thefan-in semiconductor package may be mounted on the separate interposersubstrate and then mounted on the mother board of the electronic devicethrough a packaging process again or may be embedded in the interposersubstrate and mounted on the mother board of the electronic device.

FIG. 21 is a cross-sectional view illustrating a schematic view of afan-out semiconductor package.

Referring to FIG. 21 , in the fan-out semiconductor package 2100, forexample, the outer side of a semiconductor chip 2120 is protected by anencapsulant 2130, and the connection pads 2122 of the semiconductor chip2120 are re-wired to the outer side of the semiconductor chip 2120 bythe connection member 2140. Here, a passivation layer 2150 may furtherbe formed on the connection member 2140, and an underbump metallizationlayer 2160 may further be formed in an opening of the passivation layer2150. An electrical connection structure 2107 may further be formed onan underbump metallization layer 2160. The semiconductor chip 2120 maybe an IC including a body 2121, a connection pad 2122, a passivationfilm (not shown), and the like. The connection member 2140 may includean insulating layer 2141, a re-wiring layer 2142 formed on theinsulating layer 2241, and a via 2143 electrically connecting theconnection pad 2122 and the re-wiring layer 2142.

As described above, the fan-out semiconductor package is in a form thatthe I/O terminals are re-wired and disposed even on the outer side ofthe semiconductor chip through the connection member formed on thesemiconductor chip. As described above, in the fan-in semiconductorpackage, all the I/O terminals of the semiconductor chip must bedisposed inside the semiconductor chip, and thus, if a device size isreduced, a ball size and pitch must be reduced, and as a result, astandardized ball layout may not be used. In contrast, in the fan-outsemiconductor package, since the I/O terminals are re-wired and disposedeven on the outer side of the semiconductor chip through the connectionmember formed on the semiconductor chip, although the size of thesemiconductor chip is reduced, the standardized ball layout may be usedas is. Therefore, the fan-out semiconductor package may be mounted on amother board of an electronic device even without a separate interposersubstrate as described hereinafter.

FIG. 22 is a cross-sectional view schematically illustrating a casewhere a fan-out semiconductor package is mounted on a mother board of anelectronic device.

Referring to FIG. 22 , the fan-out semiconductor package 2100 may bemounted on the mother board 2500 of the electronic device through theelectrical connection structure 2170, and the like. That is, asdescribed above, the fan-out semiconductor package 2100 may include theconnection member 2130 which may re-wire the connection pad 2122 to afan-out area beyond the size of the semiconductor chip 2120, on thesemiconductor chip 2120, the standardized ball layout may be used as is,and as a result, the fan-out semiconductor package 2100 may be mountedon the mother board 2500 of the electronic device even without aseparate interposer substrate, or the like.

In this manner, since the fan-out semiconductor package may be mountedon the mother board of the electronic device even without a separateinterposer substrate, a thickness of the fan-out semiconductor packagemay be smaller than that of the fan-in semiconductor package using aninterposer substrate, achieving a small size and a small thickness. Inaddition, since the fan-out semiconductor package has excellent thermalproperties and electrical properties, it is particularly suitable formobile products. In addition, the fan-out semiconductor package may berealized to be more compact than a general package-on-package (POP) typeusing a PCB and solve a problem caused due to a bowing phenomenon.

Meanwhile, the fan-out semiconductor package refers to a packagetechnology for mounting a semiconductor chip on a mother board of anelectronic device and for protecting the semiconductor chip from anexternal impact and has a concept different from a PCB such as aninterposer substrate which are different in scale, purpose, and thelike, and having a fan-in semiconductor package embedded therein.

As set forth above, according to an exemplary embodiment in the presentdisclosure, an antenna module according to an exemplary embodiment inthe present disclosure may have a structure which is easily miniaturizedwhile having a high level of antenna performance by having a structurein which an antenna, an IC, and a second connection member areefficiently integrated with one another.

Since the antenna module according to an exemplary embodiment in thepresent disclosure may easily increase the number of wiring layers, theantenna module may provide a ground pattern or an additional electricalpath to an IC without separately sacrificing antenna performance orwiring efficiency.

Since the antenna module according to an exemplary embodiment in thepresent disclosure may easily increase the number of wiring layerswithout separately increasing a size according to an addition of asecond connection member, the antenna module may have a structure thatis easy to miniaturize while having a high level of antenna performance.

Since the antenna module according to an exemplary embodiment in thepresent disclosure may couple the connection member and the secondconnection member to each other without using a separate electricalconnection structure such as a solder ball, the antenna module may havea structure that is easy to miniaturize.

The antenna module according to an exemplary embodiment in the presentdisclosure may secure structural stability while increasing the numberof wiring layers.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinvention as defined by the appended claims.

What is claimed is:
 1. An antenna module comprising: a first connectionmember having a first surface and a second surface, opposite to thefirst surface, and including a first wiring layer and a first insulatinglayer; an antenna package disposed on the first surface of the firstconnection member, and including a plurality of antenna membersconfigured to transmit and/or receive a first signal and a plurality offeed vias electrically connecting a corresponding one of the pluralityof antenna members to a corresponding wire of the first wiring layer; anintegrated circuit (IC) disposed on the second surface of the firstconnection member and having an active surface on which a connection padis disposed, the connection pad being electrically connected to thefirst wiring layer; a second connection member disposed between thefirst connection member and the IC, and including a second wiring layerelectrically connecting the first wiring layer to the connection pad ofthe IC; and one or more first core vias disposed on the second surfaceof the first connection member and electrically connected to the firstwiring layer so that a second signal different from the first signalpasses therethrough, wherein the second connection member has a thirdsurface facing the second surface, a fourth surface opposite to thethird surface and in direct contact with the active surface, and a sidesurface extending between the third surface and the fourth surface,wherein the side surface of the second connection member is surroundedby the one or more first core vias.
 2. The antenna module of claim 1,wherein the IC has an inactive surface opposite to the active surface,and a side surface extended between the active surface and the inactivesurface, the side surface of the IC is surrounded by the one or morefirst core vias.
 3. The antenna module of claim 1, wherein, in adirection parallel to the second surface, a width of the secondconnection member is greater than that of the IC, and smaller than thatof the first connection member.
 4. The antenna module of claim 1,wherein, in a direction perpendicular to the second surface, a height ofthe one or more first core vias is greater than a height of each of theIC and the second connection member.
 5. The antenna module of claim 1,wherein the second connection member further includes a secondinsulating layer providing the fourth surface, and a second wiring viapenetrating through the second insulating layer to connect the secondwiring layer to the connection pad.
 6. The antenna module of claim 1,further comprising a second vertical connection member disposed on thefourth surface of the second connection member and disposed to surroundthe side surface of the IC.
 7. The antenna module of claim 1, wherein abottom surface of the antenna package is in direct contact with thefirst surface provided by the first insulating layer.
 8. The antennamodule of claim 7, wherein the first connection member further includesa first wiring via penetrating through the first insulating layer toconnect one of the plurality of feed vias to the corresponding wire. 9.The antenna module of claim 1, further comprising: an encapsulantdisposed to form a cell together with the second connection member andthe IC and encapsulating at least a portion of the IC; and a cellshielding member surrounding at least a portion of the cell.
 10. Theantenna module of claim 9, wherein the cell shielding member covers sidesurface of the cell and a bottom surface of the cell.
 11. The antennamodule of claim 1, further comprising: a passive component disposed onthe second surface of the first connection member and electricallyconnected to the first wiring layer.
 12. The antenna module of claim 1,wherein the antenna package further includes: a dielectric layerdisposed to surround each of the plurality of feed vias and having athickness greater than that of the first insulating layer; and a platingmember disposed to surround each of the plurality of feed vias.
 13. Anantenna module comprising: a first connection member having a firstsurface and a second surface, opposite to the first surface, andincluding a first wiring layer; an antenna package disposed on a firstsurface of the first connection member, and including a plurality ofantenna members configured to transmit and/or receive a first signal anda plurality of feed vias electrically connecting a corresponding one ofthe plurality of antenna members to a corresponding wire of the firstwiring layer; an integrated circuit (IC) disposed on the second surfaceof the first connection member and electrically connected to the firstwiring layer to transmit a second signal different from the first signalby receiving the first signal or to transmit the first signal byreceiving the second signal; a second connection member disposed betweenthe first connection member and the IC, and including a second wiringlayer electrically connecting the first wiring layer to the IC; one ormore core vias disposed on a second surface of the first connectionmember, electrically connected to the first wiring layer so that thesecond signal passes therethrough, and surrounding the IC and the secondconnection member; an encapsulant encapsulating at least portions of theIC, the second connection member, and the one or more core vias, andhaving an opening exposing at least a portion of the one or more corevias; and an electrical connection structure disposed in the opening andelectrically connected to the one or more core vias.
 14. The antennamodule of claim 13, wherein the second connection member has a thirdsurface facing the second surface, and a fourth surface opposite to thethird surface and facing the IC, and wherein each of the third surfaceand the fourth surface has an area smaller than that of the secondsurface.
 15. The antenna module of claim 13, wherein the electricalconnection structure has a shape of one of a ball, a pin and a land. 16.The antenna module of claim 13, further comprising: a passive componentdisposed on the second surface and electrically connected to the firstwiring layer.